Stock Code

874608

MICROTEST

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AI chip tester

The AI pneumatic test fixture is mainly used for functional testing of AI chips and accompanying test motherboards. The overall structure of the fixture is an automatic lifting, drawer automatic in and out, pneumatic flip-cover structure. Through the pneumatic lifting mechanism, it realizes the up and down insertion of the chip heat dissipation and the chip module and motherboard functional interface.

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Product Overview
The AI pneumatic test fixture is mainly used for functional testing of AI chips and accompanying test motherboards. The overall structure of the fixture is an automatic lifting, drawer automatic in and out, pneumatic flip-top structure. Through the pneumatic lifting mechanism, it realizes the up and down insertion of the chip heat dissipation and the chip module and motherboard functional interface.

Key Technical Parameters
1. The test interface realizes automatic insertion and extraction once, and the automatic docking of the chip heat dissipation module reduces the operation intensity of OP and improves the test CT;
2. The insertion and extraction accuracy of the test module can reach within 0.1mm, greatly improving the stability of the fixture test;
3. Pneumatic automatic entry and exit, reducing OP operation intensity, allowing one person to operate multiple devices, increasing production capacity and saving labor costs.
4. The AI chip module and motherboard functional interfaces mainly include 26PCS UBC interfaces, 8pcs 688Pin mirror mezz adapter card connection and insertion, and 8pcs chip liquid-cooled heat sink head pressure precise control docking, etc. These interfaces are implemented through UBC module real insertion, board real insertion, mirror mezz adapter card transfer insertion, etc. for automatic testing.

Application Areas
1. Chip Design Verification:
High-speed IO testing (such as SerDes eye diagram analysis), AI computing power and energy efficiency ratio (TOPS/W) evaluation.
2. Mass Production Testing:
Wafer-level testing (Wafer Probing), post-packaging FT testing (Final Test).