Four-crystal automatic die bonder YGJ-YJE324
The nozzle is equipped with a pressure sensor for closed-loop monitoring of nozzle pressure, allowing for real-time observation of dirt and damage, and more effectively ensuring product qualification rate; the glue dispensing part has automatic height measurement for precise glue dispensing, supporting four different glue needles and compatible with four types of chips for simultaneous die bonding; the automatic loading and unloading part is compatible with various widths of base materials by adjusting the limit block; the blue film part supports 6-inch blue film trays, waffle boxes, and Gel-pak materials in all four material areas, and can be freely combined to support various die bonding modes; product compatibility: supports TO/PCB BOX die bonding; equipment accuracy: ±5μm (CPK=1.1), 90% can reach ±3μm (calibration plate bonding can reach ±1.5μm).
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Product Overview
The nozzle is equipped with a pressure sensor for closed-loop monitoring of nozzle pressure, allowing for real-time observation of dirt and damage, and more effectively ensuring product qualification rate; the glue dispensing part has automatic height measurement for precise glue dispensing, supporting four different glue needles, and is compatible with four types of chips for simultaneous die bonding; the automatic loading and unloading part is compatible with various widths of base materials by adjusting the limit block; the blue film part supports 6-inch blue film trays, waffle boxes, and Gel-pak materials in all four material areas, and can be freely combined to support various die bonding modes; Product compatibility: Supports TO/PCB BOX die bonding; Equipment accuracy: ±5μm (CPK=1.1), 90% can reach ±3μm (calibration board placement can reach ±1.5μm).
Key Technical Parameters
1. Equipment dimensions: 1410mm x 1000mm x 1800mm
2. Weight: 968KG
3. Maximum power consumption: 3KW
4. Air pressure: 0.4～0.6MPa
5. Operating voltage: 220V/AC
6. Die bonding accuracy: ±5um (cpk≥1.1), 90% can reach ±3um
7. Repeat positioning accuracy: ±2µm
8. Angle accuracy: ±0.2°
9. Die bonding pressure: 15～200g
10. Blue film size: 6 inches
Business Purpose
Corporate Mission
Wholeheartedly create value for customers, society, shareholders, and employees
Corporate Product Philosophy
Quality assurance, quality first, there is no best, only better
Corporate Spirit
Diligent and pragmatic, striving for dedication, unity and progress, pioneering and innovative
Corporate Values
Sincere cooperation, customer first, decisive action, excellence, never give up
Qualifications and Honors
Guangdong Provincial Engineering Technology Research Center for High-Precision Electronic Intelligent Testing Equipment
Top 100 Innovative Enterprises in Bao'an District, 2024
Specialized and innovative 'small giant' enterprises
High-tech enterprise
2023 Guangdong Province Enterprise that Honors Contracts and Values Credit
Level 1 Certificate in Innovation and Intellectual Property Management Capability based on ISO 56005
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