Stock Code

874608

MICROTEST

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COC clamping die bonder

The COC dispensing and bonding machine uses a clamp to pick up COC, avoiding the difficulty of using a nozzle to pick it up. It also supports dispensing/dipping modes, and the material area supports waffle boxes and Gel-pak, and supports PCB mounting.

Challenges:

It is difficult to aspirate using the COC mouthpiece.

Solutions:

Using a COC pick-and-place machine, the COC is picked up, the lens view is clear, and multi-feature recognition of different heights is satisfied

Results:

Bonding accuracy ±5µm, repeat positioning accuracy ±2µm, bonding pressure 15～200g