Stock Code

874608

MICROTEST

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Thermal Management

Liquid cooling rack scale server drainage drying and nitrogen filling equipment

Primarily used for draining, drying, and nitrogen filling of cold plate liquid-cooled rack-mount server pipelines. This equipment continuously introduces high-temperature compressed air of specified pressure and temperature into the manifold pipeline of the entire rack, discharging and collecting the liquid in the cold plate circulation pipeline. Simultaneously, it uses the principle of high-temperature evaporation to dry the circulation pipeline, ensuring the dryness and cleanliness of the cold plate circulation pipeline of the liquid-cooled rack-mount server. Finally, nitrogen gas of a certain pressure is injected according to the requirements. This equipment has temperature, humidity, pressure, nitrogen concentration, nitrogen pressure, data collection, and display functions.

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Liquid cooling rack scale server drainage drying and nitrogen filling equipment

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Product Overview
Primarily used for draining, drying, and nitrogen filling of the piping system in cold plate liquid cooling rack scale server racks. This equipment continuously introduces high-temperature compressed air of specified pressure and temperature into the manifold piping of the entire rack, discharging and collecting the liquid in the cold plate circulation piping. Simultaneously, it utilizes the principle of high-temperature evaporation to dry the circulation piping, ensuring the dryness and cleanliness of the cold plate circulation piping in the liquid cooling rack scale server. Finally, nitrogen gas of a certain pressure is introduced as needed. This equipment has temperature, humidity, pressure, nitrogen concentration, nitrogen pressure, data collection, and display functions.

Key Technical Parameters
1. Number of test ports: 2 sets (2 gas outlets, 2 drain outlets)
2. Draining and drying temperature: 0-100℃
3. Nitrogen filling pressure: 0-0.6Mpa
4. Heater temperature: 0-200℃
5. Temperature control accuracy: ±1℃
6. Nitrogen filling pressure control accuracy: 2%
7. Repeatability of nitrogen filling pressure control: 0.5%

Application Areas
I. Data centers and high-end computing applications:
1. High-density server liquid cooling system
2. Edge computing nodes
II. New energy and power applications:
1. Electric vehicle battery cooling system
2. Energy storage power stations and transformers
III. Industrial manufacturing and semiconductor applications:
1. Semiconductor wafer manufacturing
2. Precision machine tools and laser processing equipment