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874608

MICROTEST

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Thermal Management

Intelligent drainage, drying, and nitrogen filling integrated equipment

Primarily used for draining and drying pipelines in cold plate liquid-cooled servers and cabinets. If nitrogen filling is required, it can complete the nitrogen filling process and has the function of reading back the nitrogen filling pressure. Cold plate liquid-cooled servers mainly refer to liquid-cooled servers that rely on liquid cooling plates with one supply and one return (or multiple) circulation pipelines to dissipate heat from components. It uses the coolant circulating in the liquid cooling plate to remove the heat generated by the liquid-cooled server components.

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Intelligent drainage, drying, and nitrogen filling integrated equipment

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Product Overview
Primarily used for draining and drying pipelines in cold plate liquid-cooled servers and cabinets. If nitrogen filling is required, it can complete the nitrogen filling process and has the function of reading back the nitrogen filling pressure. Cold plate liquid-cooled servers mainly refer to liquid-cooled servers that rely on liquid cooling plates with one supply and one return (or multiple) circulation pipelines to dissipate heat from components. It uses the coolant circulating in the liquid cooling plate to remove the heat generated by the liquid-cooled server components.

Key Technical Parameters
1. GPU Cold Plate: Flow rate 6 L/min, Flow resistance 17.5 kPa
Flow rate 10 L/min, Flow resistance 45 kPa
2. CPU Cold Plate: Flow rate 0.6 L/min, Flow resistance 11 kPa
Flow rate 1.6 L/min, Flow resistance 49 kPa
Pressure Sensor
1. Measurement range: 0–1 MPa
2. Response time: < 10 ms
3. Overall accuracy: 0.25% FS
4. Repeatability: ≤±0.2% FS/year
5. Zero-point temperature drift: ±0.03% FS/℃
6. Sensitivity drift: ±0.03% FS/℃
Temperature Sensor
1. Measurement range: 0–200℃
2. Mechanical flow sensor
3. Response time: ≤5 s
4. Accuracy: ≤±1.5% FS
Humidity Sensor
1. Measurement range: 0–100% RH
2. Humidity accuracy: ±3%

Application Areas
I. Data centers and high-end computing applications:
1. High-density server liquid cooling system
2. Edge computing nodes
II. New energy and power applications:
1. Electric vehicle battery cooling system
2. Energy storage power stations and transformers
III. Industrial manufacturing and semiconductor applications:
1. Semiconductor wafer manufacturing
2. Precision machine tools and laser processing equipment