COC clamping die bonder YTP-YJA023
COC dispensing and bonding machine, with a clear lens view, satisfying multi-feature recognition at different heights. It uses a clamping method to pick up COC, avoiding the difficulty of using a nozzle for suction. It also supports dispensing/dipping modes, and the material area supports waffle boxes and Gel-pak; PCB mounting is supported.
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Product Overview
COC dispensing and die bonding machine, with a clear lens perspective, meeting the needs of multi-feature recognition at different heights. It uses a clamping method for COC, avoiding difficulties associated with suction nozzle pickup. It also supports dispensing/dipping modes, and material areas support waffle boxes and Gel-pak; PCB mounting is supported.
Key Technical Parameters
1. Equipment Dimensions: 1410mm x 1000mm x 1800mm
2. Weight: 500KG
3. Maximum Power Consumption: 2KW
4. Air Pressure: 0.4～0.6MPa
5. Operating Voltage: 220V/AC
6. Die Bonding Accuracy: ±5µm
7. Repeat Positioning Accuracy: ±2µm
8. Angle Accuracy: ±1°
9. Die Bonding Pressure: 15～200g
10. Ambient Temperature: 20℃-26℃
Business Purpose
Corporate Mission
Wholeheartedly create value for customers, society, shareholders, and employees
Corporate Product Philosophy
Quality assurance, quality first, there is no best, only better
Corporate Spirit
Diligent and pragmatic, striving for dedication, unity and progress, pioneering and innovative
Corporate Values
Sincere cooperation, customer first, decisive action, excellence, never give up
Qualifications and Honors
Guangdong Provincial Engineering Technology Research Center for High-Precision Electronic Intelligent Testing Equipment
Top 100 Innovative Enterprises in Bao'an District, 2024
Specialized and innovative 'small giant' enterprises
High-tech enterprise
2023 Guangdong Province Enterprise that Honors Contracts and Values Credit
Level 1 Certificate in Innovation and Intellectual Property Management Capability based on ISO 56005
Product Inquiry
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