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Microtest obtained a patent for a multi-station motherboard heat dissipation testing device, which can achieve efficient motherboard heat dissipation.
Release Date: 2025-06-06 16:46
June 6, 2025 - Microtest announced that it has been granted Chinese utility model patent CN222954267U for a "Multi-Station Motherboard Thermal-Testing Apparatus." The application was filed in June 2024.
Patent abstract: This utility model discloses a multi-station motherboard heat dissipation testing device, including a support component, a cooling mechanism, a detection mechanism, and a transmission component. The cooling mechanism is vertically installed on the support component and connected to the support component for motherboard heat dissipation. The detection mechanism is vertically installed on the support component and connected to the support component for motherboard detection. The transmission component is vertically installed on the support component and connected to the support component to drive the support component to move. The cooling mechanism includes a finned tube, which is vertically installed on the support component and connected to the support component for motherboard cooling. Through the combination of finned tubes, water pipes, and heat sinks, efficient motherboard heat dissipation can be achieved. This combined heat dissipation system not only increases the heat dissipation area and improves heat dissipation efficiency, but also quickly reduces the motherboard temperature, ensuring stable operation of the motherboard.
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